In-Depth Analysis Of 10 Nm Exynos Processor Using Micro Ct And Fib-Sem System

Latest technology nodes have made finer, more precise physical failure analysis techniques to emerge. Conventional techniques for larger technology nodes are slowly becoming ineffective. In this paper, we discuss effective yet non-invasive technique like micro CT where we get high fidelity images of the Exynos processor and complement it with further analysis using FIB-SEM systems based preparation techniques like site-specific homogenous delayering, in-situ probing and TEM lamella preparation which enables failure analysis and reverse engineering techniques like nanoprobing and TEM imaging possible.