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Impact of the Formation of Intermetallic Compounds in Current-Carrying Connections

Marcella Oberst,Stephan Schlegel,Steffen Großmann,Heidi Willing,Renate Freudenberger

IEEE Transactions on Device and Materials Reliability（2020）

Cited 7|Views3
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Abstract
In electrical power engineering a number of different metallic materials are applied. At interfaces of current-carrying connections, these materials meet. Depending on the combination, intermetallic compounds (IMC) can form between the different metals. Interdiffusion and the resulting formation of IMC has been considered an important aging mechanism for such interfaces affecting their long-term r...
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Key words
Temperature measurement,Resistance,Intermetallic,Electrical resistance measurement,Current measurement,Annealing
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