Combined Symbol Error Correction and Spare Through-Silicon Vias for 3D Memories

Three dimensional technology provides high density and bandwidth solutions for high-speed computing. Through-silicon vias (TSVs) are used to interconnect different layers of the stacked dies. Covering for faulty TSVs caused by manufacturing irregularities can be done by including spare TSVs in the chip design and rerouting signals to avoid the problematic vias. Temporary and permanent faulty TSVs ...