Electrical Modeling and Analysis of Through-Silicon-Via Crosstalk Based on Scalable Physical Lumped Circuit Model for 3D Packaging

In this paper, we investigate the transportation mode of TSV structure for subsequent modeling G-S TSVs. Next, a scalable physical lumped circuit model of ground-signal TSVs is established The scalable G-S TSVs model is developed with closed-form analytic RLGC equations derived from physical structure, and can be changed with structure parameters in design process accordingly. The validity of this model is verified with full-wave FEM-based simulator up to 20 GHz. Based on this accurate physical lumped circuit model, we investigate crosstalk of TSV array in both frequency domain and time domain. The method of modeling and analysis of TSV array crosstalk proposed in this paper can effectively reduce simulation time and computing resource over finite-element-based 3-D full-wave simulation.