Effects of Thermal and Electrical Contact Resistances on the Performance of a Multi-couple Thermoelectric Cooler with Non-ideal Heat Dissipation

Guoliang Xu,Yang Duan,Xintao Chen,Tingzhen Ming,Xiaoming Huang

Applied Thermal Engineering（2020）

引用 17|浏览8

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摘要

•A 3D finite element model is built for commercial bismuth telluride thermoelectric coolers (TECs).•The influence of adverse working conditions on the cooling performance of TECs is studied quantitatively.•Of all adverse factors, electrical contact resistance may cause the most severe reduction in a TEC's performance.•A phenomenon of drift of optimal current in a TEC under adverse working condition is found and discussed.

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关键词

Thermoelectric cooling,Thermoelectric chip,Chip cooling performance,Adverse working conditions

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