Flex Cracking Of Multilayer Ceramic Capacitors: Experiments On Fracture Propagation

european microelectronics and packaging conference(2019)

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摘要
This paper presents a comparison between a three point and a four point flexural board test. Multilayered ceramic capacitors were soldered onto the board using SAC305 solder while force and capacitance measurements were acquired during the bending. Additionally pictures of the board were taken to determine the curvature radius of the board. The capacitors are then metallographic prepared for microscopy of the cross sections, which off.; a precise picture of the origin and propagation of the crack.
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MLCC,reliability
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