The application of an analytical model to solve an inverse heat conduction problem: Transient solidification of a Sn-Sb peritectic solder alloy on distinct substrates

•A thermal/experimental approach is proposed to analyze solder/substrates interaction.•A Sn-Sb solder solidified against three substrates gives experimental support to the approach.•Wettability is shown not to be the only important parameter for solder/substrate interaction.•A thermal analytical model can preview voids at the alloy/substrate interface.