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Modeling and estimation of hole-type flaws on cracking mechanism of SiC ceramics under uniaxial compression: A 2D DEM simulation

Shengqiang Jiang,Mingxue He,Xu Li,Chao Tang,Jingang Liu,Sisi Liu

Theoretical and Applied Fracture Mechanics（2020）

Cited 11|Views11
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Abstract
•Different hole-type flaws were constructed by the super-ellipse equation and DEM.•Cracking mechanism of SiC under different inclination angles was investigated.•Results shown that the secondary cracks are caused by tensile and shear forces.•The maximal-shear-stress concentration region around a flaw is related on inclination angle and aspect ratio.
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Key words
Hole-type flaws,Cracking mechanism,Ceramic materials,DEM simulation
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