One-Side Cutting Strategy for Ultraprecise Single Point Cutting of V-grooves Case 1: Constant Chip Thickness

V-groove microstructures have found a variety of applications across different fields. Presently, they are widely utilized for different surface functionalization purposes ranging from optical to non-optical. So far, single point cutting constitutes the main technology used to fabricate this particular type of surface microstructures. However, the surveyed literature revealed a paucity of in-depth studies focused on V-groove fabrication process. To address this, a one-side cutting strategy will be presented in this study, its primary goal being to generate intended microstructures with constant chip thickness. The analytical approach developed in context has resulted in a multi-pass path planning strategy. To complement that, the cutting forces generated during the process were experimentally measured alongside with the surface quality on V-groove facets. The results obtained have validated the expected linear dependency between the chips removed and the cutting force amplitude. In addition to this dependency, the tested one-side cutting strategy proved to be capable of producing ultraprecise surfaces characterized by an areal surface roughness under 10 nm.