I. Double-Sided Cooling Technology for Emobility
European Solid-State Device Research Conference(2019)
摘要
In this paper we introduce a device concept for double-sided cooling based on a molded module. This concept allows device shrinking and tackling the needed power density. Thermo-mechanical investigations together with proper processes and material choices are prerequisite to reach the needed reliability. Our used simulation model is successfully validated with experimental data and able to predict the thermo-mechanical behavior of such molded power module.
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关键词
double-sided cooling,molded module,power device,thermo-mechanical study
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