Effect of holding time on the microstructure and strength of tungsten/steel joints by HIP diffusion bonded using a Cu interlayer

•Hot Isostatic Pressing bonding is performed on W/316L joints using Cu interlayer.•Neither intermetallic compounds nor brittle phases form at the interfaces.•The average tensile strength of W/316L joint is as high as 480 MPa.•Mechanical properties are improved by Cu interlayer solid solution strengthening.