Cooled Silicon-On-Insulator Diode Thermometer: Toward Thz Passive Imaging

J. Blond,J. Meilhan, A. Aliane,L. Dussopt

2019 44TH INTERNATIONAL CONFERENCE ON INFRARED, MILLIMETER, AND TERAHERTZ WAVES (IRMMW-THZ)(2019)

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摘要
Terahertz passive imaging requires high sensitivity detectors, with Minimum Detectable Power (MDP) under the picowatt range. An antenna-coupled cooled microbolometer, incorporating a lateral PiN-like diode as thermometer, could represent a solution. In a first step, such diode performances have to be investigated, especially the temperature coefficient of current (TCC) and the low frequency noise. Prototypes were fabricated on Silicon-On-Insulator (SOI) 4 '' wafers with 50-nm active silicon layer. I-V and noise measurements down to 81K were useful to derive the electrical MDP of the future bolometer, already reaching 6.6 pW at 10 frames per second.
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关键词
THz passive imaging,terahertz passive imaging,minimum detectable power,lateral PiN-like diode,noise measurements,electrical MDP,cooled silicon-on-insulator diode thermometer,antenna-coupled cooled microbolometer,TCC,temperature coefficient of current,SOI,power 6.6 pW,size 50 nm
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