Ultra-thin flattened heat pipe with a novel band-shape spiral woven mesh wick for cooling smartphones

•UTHP with a novel spiral woven mesh wick was designed for cooling smartphones.•The wick was woven in a band-shape to realize an ultra-thin and tight structure.•Cross-sectional area ratio of the wick to the UTHP affected its thermal performance.•Increasing woven wires did not significantly improve the UTHP thermal performance.•Gravity had little effect on the heat dissipation performance of the UTHP module.