Characterization of Silicon Photonics Modulator Integration and High Efficiency Testing Platform
international conference on group iv photonics(2019)
摘要
We successfully establish a silicon photonics device manufacturing and testing platform in 200mm SOI wafer. We integrate modulator and driver chip to show 30Gb/s PAM4 capability. A fully-automatic wafer level characterization process is built up for all optical devices in surface coupling method.
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关键词
silicon photonics, modulator, wafer level measurement
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