Experimental evaluation of a compact two-phase cooling system for high heat flux electronic packages

Fengze Hou,Wenbo Wang,Hengyun Zhang,Cheng Chen,Chuan Chen,Tingyu Lin,Liqiang Cao,G.Q. Zhang,J.A. Ferreira

Applied Thermal Engineering（2019）

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摘要

•The system can dissipate over 380 W/cm2 while keeping chip temperature at 90 °C.•Heat flux that the system could dissipate decreases with heat source area.•The downstream super heater can improve the thermal performance.•Increasing differential pressure can improve the heat dissipation capacity.

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关键词

Aluminum plate fin evaporator,Two-phase cooling,Thermal test vehicle,High heat flux,Heat dissipation capacity

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