Assembly of multiple ultra-thin chips on flexible foils with high placement accuracy by a simple transfer process

This article presents a simple approach for high-accuracy assembly of multiple ultrathin chips on flexible foil substrates. The chips are placed initially in the cavities on a chip carrier substrate and transferred onto a thermally releasable adhesive tape. After application of the epoxy-based adhesive onto the chip surface, the chips are transferred onto the foil substrate. Finally, the epoxy adh...