Advanced Substrates for GaN-Based Power Devices
2019 IEEE 69TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC)（2019）
关键词
AlGaN/GaN,power devices,substrate transfer,HEMTs,SBDs,bonding,copper,thermal management
AI 理解论文
溯源树
样例
生成溯源树，研究论文发展脉络
Chat Paper
正在生成论文摘要