Evaluation of Fine-Pitch Routing Capabilities of Advanced Dielectric Materials for High Speed Panel-RDL in 2.5D Interposer and Fan-Out Packages

High-bandwidth computing with low power requires high-density low-loss interconnects with advanced design rules that cannot be realized with standard epoxies. This paper evaluates the critical material properties required to meet next-generation RDL needs for 2.5D interposer and fan-out packages. It demonstrates that shifting towards lower Dk materials can support higher data rates and maintain high wiring density, thus enabling overall system bandwidth improvement. This paper provides a complete analysis of the material property requirements, critical design metrics, and process options to qualify dielectrics for next-generation high-bandwidth demand.