Thin Film Optical Characteristics of InP/Si Hybrid Wafers by Chip-on-Wafer Direct Transfer Bonding Technology

Nobuhiko Nishiyama,Kazuya Ohira,Liu Bai,Yoichiro Kurita,Hideto Furuyama,Miki Inamura,Tomoyuki Abe,Takuya Mitarai,Kenji Morita,Shigehisa Arai

2019 Compound Semiconductor Week (CSW)（2019）

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摘要

Investigation of thin film characteristics of InP/Si hybrid wafers by novel chip-on-wafer direct transfer bonding technology (CoW-DTB) was carried out. 36 InP chips were successfully bonded on Si wafers by CoW-DTB and photoluminescence properties were measured and compared by 1.3-μ m AlGaInAs quantum wells samples with different bonding interface after removing InP substrate.

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关键词

Direct bonding,Heterogenious integration Photonic integrated curcuit

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