3D-MID Evaluation and Validation for Space Applications

Space applications demand highly reliable, low weight systems. 3-dimensional moulded interconnect device (3D-MID) processes have the potential to fulfil the requirements by combining the (electronic) packaging with routing and mechanical structures. In this paper 3D-MID technology is reviewed, most promising techniques identified and test vehicles investigated with the focus on their future use in space. This work is performed within the ESA Artes 5.1 programme.