Programmable Micro-Object Assembly With Transfer

A deterministic micro-assembly and transfer for fine scale heterogeneous integration of micro-objects is described. With addressable electrode arrays, we use programmable directed electrostatic assembly to demonstrate micrometer scale placement and orientation control of micro-objects. Parallel, automated, programmable assembly is demonstrated with beads (10 mu m) and silicon chips (150 mu m). Automated heterogeneous assembly is demonstrated, as well as transfer to a final substrate with 1 mu m registration. Integrated continuous feed assembly and transfer with a roller-based approach is demonstrated with >150 silicon chips, producing a centimeter scale output. These results show progress towards our vision of a high throughput micro-assembly printer system for integrating a broad range of micro-objects into next generation systems.