Non-Periodic Flipped EBG for Dual-Band SSN Mitigation in Two-Layer PCB

Hsin-Chan Hsieh,Hao-Wei Chan,Yu-Cong Wang,Ying-Hsi Lin,Wen-Shan Wang,Shih-Hung Wang,Ruey-Beei Wu

IEEE Transactions on Components, Packaging and Manufacturing Technology（2019）

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摘要

Several electromagnetic bandgap (EBG) structures have been designed to mitigate simultaneous switching noise (SSN) problems in dual bands in wireless local area networks (WLANs). In order to be applicable to two-layer printed circuit boards (PCBs), a novel flipped structure is introduced, which also creates slots for a wide stopband. This article proposes a 2 × 2 nonperiodic flipped-EBG (FEBG) for...

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关键词

Periodic structures,Metamaterials,Metals,Resonant frequency,Dual band,Wireless LAN,Packaging

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