Effect of I/Ag molar ratio on silver thick films below 550 °C

The effect of low I/Ag ratios on the performance of silver thick films containing micro-sized silver particles treated with surface iodination has been investigated. The film with I/Ag ratio of 1:100 exhibited high electrical conductivity and densification, while that of 2:100 presented better adhesion. The conductivity and densification of the film reached the highest at 550 °C. Optimal conductivity of the film with I/Ag ratio of 1:100 and 2:100 was 11.45 and 15.85 mΩ/sq., respectively. In addition, the film adhesion was enhanced by heating. Different trends observed in electrical conductivity and adhesion as functions of temperature is primarily attributed to shrinkage of modified particles. This work suggested that the I/Ag ratio plays a vital effect on the performance of the silver thick film.