Towards a Distributed, Chronically-Implantable Neural Interface
2019 9TH INTERNATIONAL IEEE/EMBS CONFERENCE ON NEURAL ENGINEERING (NER)(2019)
摘要
We present a platform technology encompassing a family of innovations that together aim to tackle key challenges with existing implantable brain machine interfaces. The ENGINI (Empowering Next Generation Implantable Neural Interfaces) platform utilizes a 3-tier network (external processor, cranial transponder, intracortical probes) to inductively couple power to, and communicate data from, a distributed array of freely-floating mm-scale probes. Novel features integrated into each probe include: (1) an array of niobium microwires for observing local field potentials (LFPs) along the cortical column; (2) ultra-low power instrumentation for signal acquisition and data reduction; (3) an autonomous, self-calibrating wireless transceiver for receiving power and transmitting data; and (4) a hermetically-sealed micropackage suitable for chronic use. We are additionally engineering a surgical tool, to facilitate manual and robot-assisted insertion, within a streamlined neurosurgical workflow. Ongoing work is focused on system integration and preclinical testing.
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关键词
platform technology,implantable brain machine interfaces,ENGINI platform,3-tier network,external processor,cranial transponder,intracortical probes,inductively couple power,distributed array,mm-scale probes,local field potentials,autonomous self-calibrating wireless transceiver,transmitting data,ultralow power instrumentation,chronically-implantable neural interface,empowering next generation implantable neural interfaces
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