Flexible Water-proof Bio-Integrated Electronics
2019 Electron Devices Technology and Manufacturing Conference (EDTM)(2019)
摘要
Due to the absence of thin-film barriers to biofluids with multidecade lifetimes, the penetration of biofluids into the devices and any ensuing electrochemical reactions pose significant safety risks. Here, we overcome these challenges by combining pristine thermal SiO2 layers with processing steps for their integration onto flexible electronics. We showed that an ultrathin, leakage-free, biocompatible dielectric layer which can completely seal the device. The resulting current-leakage levels and operational lifetimes have been improved significantly.
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关键词
Silicon,Flexible electronics,Transistors,Substrates,Thermal conductivity,Sensors,Encapsulation
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