Hybrid Materials: Flexible and Ultrasoft Inorganic 1D Semiconductor and Heterostructure Systems Based on SnIP (Adv. Funct. Mater. 18/2019)

In article number 1900233, Gregor Kieslich, Karthik Shankar, Tom Nilges, and co-workers, prepare organic and inorganic hybrids, illustrating that SnIP is a candidate to fabricate flexible 1D composites for energy conversion and water splitting applications. SnIP@C3N4 hybrid forms an unusual soft material core–shell topology with graphenic carbon nitride wrapping around SnIP.