Evaluation of Hybrid Bonding Interface Quality by Contact Resistivity Measurement
IEEE Transactions on Electron Devices(2019)
摘要
With the rise of hybrid bonding as a solution for fine pitch 3-D integration, new methods are required to evaluate the bonding quality at a wafer level. Contact resistance is widely used for process control but measurements can be corrupted by the 3-D stack complexity and the misalignment of wafers. In order to measure the specific contact resistivity of dual-damascene interconnects and evaluate t...
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关键词
Bonding,Conductivity,Resistance,Electrical resistance measurement,Contact resistance,Metals
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