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Multi-Wavelength Optical Transceivers Integrated On Node (Motion)

Daniel Kuchta,Jonathan Proesel,Fuad Doany,Wooram Lee,Timothy Dickson,Herschel Ainspan,Mounir Meghelli,Petar Pepeljugoski,Xiaoxiong Gu,Michael Beakes,Mark Schultz,Marc Taubenblatt,Paul Fortier,Catherine Dufort, Eric Turcotte, Marc-Olivier Pion, Charles Bureau,Frank Flens, Greta Light, Blake Trekell,Kevin Koski

2019 OPTICAL FIBER COMMUNICATIONS CONFERENCE AND EXHIBITION (OFC)（2019）

Cited 13|Views171
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Abstract
We report on efforts to develop a high speed, low cost, low energy chip scale optical module for co-packaging on a first-level organic substrate for HPC and Data Center applications.
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Key words
MOTION,low energy chip scale optical module,first-level organic substrate,Data Center applications,HPC applications,multiwavelength optical transceivers integrated on node
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