Multi-Wavelength Optical Transceivers Integrated On Node (Motion)
2019 OPTICAL FIBER COMMUNICATIONS CONFERENCE AND EXHIBITION (OFC)(2019)
Abstract
We report on efforts to develop a high speed, low cost, low energy chip scale optical module for co-packaging on a first-level organic substrate for HPC and Data Center applications.
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Key words
MOTION,low energy chip scale optical module,first-level organic substrate,Data Center applications,HPC applications,multiwavelength optical transceivers integrated on node
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