Feasibility Studies and Advantages of Using Dual Fiber Array in Laser Ultrasonic Inspection of Electronic Chip Packages

Fabrication and inspection techniques of electronic packages are two key factors influencing a chip's success in post-Moore's law era. As the electronic packaging industry rapidly evolves to cope with modern demands, a versatile inspection method for present and future packages is required. One approach is the development of a fiber array laser ultrasonic inspection system as presented in this pap...