Elevated temperature directional recrystallization of high-purity nickel

Electron backscattered diffraction has been used to characterise the three different kinds of boundaries that occur in grains that are generated by secondary recrystallization during directional annealing of high-purity nickel. Boundaries between columnar grains (CC boundaries) can be twin boundaries, low-angle boundaries or high-angle grain boundaries. The frequency of low-angle CC boundaries dropped from 25% to 0% while the frequency of the high-angle CC boundaries increased from 19% to 67% when the annealing temperature was increased from 1000 degrees C to 1200 degrees C. The misorientation angles of boundaries between columnar grains and small equiaxed grains ahead of them (CE boundaries) was random at 1200 degrees C but had a 40 degrees rotation relationship about ⟨111⟩ at 1000 degrees C. It was found out that the character of the CC boundaries is determined by relative mobility of the CE boundaries, which is determined by the processing temperature rather than the energy of the CC boundaries themselves. The character of the island grain boundaries sometimes found with columnar grains was not affected by the annealing temperature or the drawing velocity.