Power Delivery Network (PDN) Modeling for Backside-PDN Configurations With Buried Power Rails and $mu$ TSVs
IEEE Transactions on Electron Devices(2020)
摘要
In this article, a power delivery network (PDN) modeling framework for backside-PDN configurations is presented. A backside-PDN configuration contains dense microthrough silicon vias (μTSVs) and power/ground metal stack on the backside of the die. This approach separates the PDN from a conventional signaling network of the back-end-of-the-line (BEOL) and improves power integrity and core utilizati...
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关键词
Metals,Through-silicon vias,Density measurement,Power system measurements,Integrated circuit interconnections,Rails,Switches
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