Influence of the paste volume on the contact formation in fine line metallization

Metallization of industrial silicon solar cells is evolving towards fine line printing with a line width of 30 μm and lower. Besides the challenge to keep up a high aspect ratio this might also result in higher contact resistivities. This work investigates the influence of the paste volume on the contact formation for fine line metallization. It is shown that the paste volume has an influence on the contact resistivity. But it depends on the used paste if this influence is detrimental or advantageous for the contact formation on reduction of the paste volume.