Low-Loss Wafer-Scale Silicon Photonic Interposer Utilizing Inverse-Taper Coupler

This paper experimentally demonstrates a low loss inter-chip coupler with coupling loss below 1dB utilizing inverse-taper coupling from a wafer scale silicon photonic interposer, designed to distribute laser emission to 100 photonic integrated circuit dies (PICs) with equal power and phase. During the packaging, PICs are flip-chip bounded onto the interposer to achieve electrical, optical, and thermal coupling.