Investigation On The Vibration Amplitude Of Au Bonding Wire Under Mechanical Shock
2018 25TH IEEE INTERNATIONAL SYMPOSIUM ON THE PHYSICAL AND FAILURE ANALYSIS OF INTEGRATED CIRCUITS (IPFA)(2018)
摘要
The vibration amplitude of single Au bonding wire under mechanical shock is studied by experiment and simulation. The maximum amplitude is successfully measured by dual electrical voltage method using the prepared sample and oscilloscope. Besides, the relationship between the vibration amplitude and the shock magnitude is simulated by finite element analysis(FEA). The tendency of the experiment and simulation results match well, which clarifies the amplitude variation with increasing the shock magnitude and provides significant reference for the reliable design of high density bonding.
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关键词
Mechanical shock, Vibration amplitude, Bonding wire
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