A Novel Engraving Planarization Innovation to Rectify Non-Consistency Post Chemical Mechanical Cleaning

The presentation of 3-D structures and new materials for cutting edge rationale gadgets at greatly fine element measure presents challenges for inside wafer and wafer-to-wafer thickness consistency control that is basic for yield and execution. For customary substance mechanical cleaning innovation, the commonplace thin film consistency over the entire wafer may not meet the coveted variety focus of 2–3 nm 3? at some basic levels. Besides, wafer-to-wafer consistency variety requires a wafer by wafer way to deal with consistency remedy. In this paper, a novel engraving planarization innovation is exhibited that consolidates an ordinary creation demonstrated engraving process that is temperature delicate with an inductively coupled plasma reactor outfitted with a novel electrostatic toss that gives bite the dust level warm control. Enhanced process control empowers financially savvy consistency upgrades in overabundance of 85%.