Manufacturable Low-Cost Flip-Chip Mounting Technology for 300–500-GHz Assemblies

We developed a chip mounting technology suitable for low-cost assemblies in the 300-500-GHz frequency range, compatible with standard chip and submount fabrication techniques. The waveguide and transition designs are compatible with indium phosphide heterobipolar transistor millimeterwave monolithic integrated circuit chip architecture. Increased conductor shielding in different multilayer thin-fi...