Electrochemical Migration of ENIG surface finish in Na2 SO4 Environment
2018 41st International Spring Seminar on Electronics Technology (ISSE)(2018)
Abstract
The electrochemical migration (ECM) behavior of Electroless Nickel Immersion Gold (ENIG) surface finish was studied using Na
2
SO
4
solutions with various concentrations. The investigations were carried out by water drop (WD) test. During WD test the electrochemical processes were followed by electrical and visual inspections. Based on the mean-time-to-failure (MTTF) data it was shown that MTTF increased at 0.1 mM Na
2
SO
4
solution, then on higher concentrations MTTF significantly decreased and stabilized over the concentrations.
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Key words
electroless nickel immersion gold surface finish,electrochemical process,WD test,water drop test,ECM,electrochemical migration behavior,ENIG surface finish,mean-time-to-failure data,visual inspections,electrical inspections,Na2SO4,NiAu
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