Thermal modeling and measurement of a power amplifier module for a silicon-ceramic substrate

In the present paper, the thermal behavior of a power amplifier on a printed circuit board (PCB) and in a low-temperature co-fired ceramics module is examined by thermal FE modelling and measurements on the PCB module. The thermal impact on the performance of the PA and its power dissipation are determined by harmonic balance simulation and measurements. Based on these simulations, an integrated design of a demonstrator system on SiCer is pursued.