A 0.9GHz self-packaged power amplifier based on SISL platform

2017 IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications (IMWS-AMP)(2017)

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Abstract
In this paper, a novel 20W self-packaged power amplifier (PA) based on substrate integrated suspended line (SISL) platform is proposed. Dual-layer inductors, capacitors and feedlines are proposed to minimize loss and size, all of them are embedded inside the multi-layer SISL structure, and the implemented PA becomes self-packaged. The simulated PA operates at 0.9GHz, with a fractional bandwidth of 22.2%, the maximum PAE is 49.74% with an output power of 43dBm, the maximum gain is 18.91dB, the in-band gain flatness is better than 0.5dB and the total size is only 0.7λ g × 0.37λ g × 0.03λ g , λ g represents the guided wavelength at center frequency 0.9GHz.
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Key words
Substrate integrated suspended line,power divider (PD),power amplifier,power-combined amplifier (PCA),compact size,low loss,self-packaged circuits
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