近贴聚焦成像器件管体熔铟层气孔产生的因素分析
Vacuum Electronics（2011）
Abstract
为解决成像器件管体熔铟层产生流散不均匀、熔层断裂、体内气泡造成的光电阴极与管体封接漏气问题,深入分析了产生根源,研究了一种管体注铟技术,使管体注铟合格率达到了100%,光电阴极与管体封接气密性成品率达到了98%。
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Key words
Weld layer bubbles,Tube body pouring indium,Indium tin alloy layer,Imaging devices,Proximity focus
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