Chrome Extension
WeChat Mini Program
Use on ChatGLM
VIPCreated with Sketch.

烧结温度对低温陶瓷结合剂性能的影响

HOU Yong-gai,ZHU He,LI Zheng-xin

Superhard Material Engineering（2008）

Cited 4|Views4
No score
Abstract
文章研究了不同烧成温度下低温结合剂的烧结范围、强度、硬度,用XRD和SEM对不同烧成温度下陶瓷结合剂金刚石的结构进行了分析。结果发现:试验陶瓷结合剂在开始软化点725℃最适合陶瓷结合剂金刚石磨具的烧成,在该温度下烧成结合剂呈比较均匀的玻璃状态,对金刚石磨粒的润湿性好;在725℃烧成,结合剂的流动性为120%;结合剂试样的弯曲强度和洛氏硬度最大,分别为58.5M Pa和93.5(HRA)。
More
Translated text
Key words
vitrified bond,diamond tool,sintering temperature,fluidity
AI Read Science
Must-Reading Tree
Example
Generate MRT to find the research sequence of this paper
Chat Paper
Summary is being generated by the instructions you defined