Radiation Damage In Transistors Fabricated With Lapis Semiconductor 200 Nm Fd-Soi Technology

2014 IEEE Nuclear Science Symposium and Medical Imaging Conference (NSS/MIC)(2014)

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摘要
The paper presents radiation tolerance of the transistor TEG (TrTEG5) test structure fabricated in 200 nm fully depleted silicon on insulator technology dedicated to production of SOI detectors. The chip was irradiated with 60 Cobalt gamma-ray source to total dose of 1.175 kGy at a rate of 67.8 Gy/h. During irradiation, current-voltage characteristics of seventeen different transistors were measured so as to investigate factors affecting radiation resistance. Transistors' threshold voltage shift and transconductance change as a function of the deposited dose are presented. After irradiation all transistors manifested correct operation and threshold voltage change of around 200 mV fall within the limits of specified technological mismatch.
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关键词
radiation damage,Lapis semiconductor,FD-SOI Technology,radiation tolerance,transistor TEG test structure,fully depleted silicon on insulator technology,60cobalt gamma-ray source,current-voltage characteristics,voltage shift,transconductance,size 200 nm,radiation absorbed dose 1.175 kGy,Si
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