PLC-based WDM transceiver with modular structure using chip-scale-packaged OE-devices

Yoshinori Nakanishi, Hiroshi Hirota,K Watanabe,Yoshio Hashizume,Ikuo Ogawa,Masaru Ishii,Masaki Kohtoku,Masashi Yanagisawa,Jun Endo,Tomohiro Kurosaki,Yasuo Inoue

Sydney, NSW（2005）

Cited 3|Views6

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Abstract

We propose a novel modular integrated structure to improve the fabrication yield and reliability of planar lightwave circuit (PLC) hybrid-integrated modules. As a key component, we have developed a chip-scale packaging technique for opto-electronic (OE-) devices, and successfully fabricated a 1.3/1.49/1.55-mum optical WDM transceiver module

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Key words

chip-on-board packaging,integrated optics,integrated optoelectronics,modules,optical communication equipment,optical fabrication,optoelectronic devices,reliability,transceivers,wavelength division multiplexing,oe-devices,plc,wdm,chip-scale-packaging,module,transceiver,chip scale packaging,chip scale package

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