PLC-based WDM transceiver with modular structure using chip-scale-packaged OE-devices
Sydney, NSW(2005)
Abstract
We propose a novel modular integrated structure to improve the fabrication yield and reliability of planar lightwave circuit (PLC) hybrid-integrated modules. As a key component, we have developed a chip-scale packaging technique for opto-electronic (OE-) devices, and successfully fabricated a 1.3/1.49/1.55-mum optical WDM transceiver module
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Key words
chip-on-board packaging,integrated optics,integrated optoelectronics,modules,optical communication equipment,optical fabrication,optoelectronic devices,reliability,transceivers,wavelength division multiplexing,oe-devices,plc,wdm,chip-scale-packaging,module,transceiver,chip scale packaging,chip scale package
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