电子封装用石墨泡沫/Sn-Bi合金复合材料微观结构和热物理性能

Pengfei Lian,Jinliang Song,Shi-wen Lei,Zechao Tao,Hong-chao Zhao,Junpeng Zhang,Zhanjun Liu

New Carbon Materials（2018）

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Abstract

以中间相沥青为原料,采用加压发泡法制备出不同结构和性能的高导热石墨泡沫.通过Sn-Bi合金高温熔融浸渍石墨泡沫,制备了电子封装用高导热石墨泡沫/Sn-Bi合金复合材料,系统研究了该材料的微观结构和热物理性能.结果表明,Sn-Bi合金均匀分散于石墨泡沫的孔隙结构中;复合材料的密度为3.83±0.01 g/cm3,其热扩散系数达到163.1±3 mm2/s,材料的热膨胀系数为8.08±0.02 ppm/K明显低于合金材料的20.7±0.02 ppm/K.通过石墨泡沫基体密度和结构的调控,可制备出低膨胀系数(8.08±0.02,16.4±0.02 ppm/K)的电子封装用高性能石墨泡沫/Sn-Bi合金复合材料.

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Key words

Mesophase pitch-based graphite foam,Sn-Bi alloy,High thermal conductivity,Low coefficient of thermal expansion

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