Nano C-V imaging of Semiconductor Devices with Scanning Microwave Impedance Microscopy

Oskar Amster,Kurt Rubin,Yongliang Yang, Dorai Iyer, A. Messinger, R. Crowder

2018 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)(2018)

引用 0|浏览2
暂无评分
摘要
Two doped semiconductor samples are measured using probe-based Scanning Microwave Impedance Microscopy (sMIM). One is a plan-view polished CMOS image sensor and the other is a cross-section polished power device. Both samples are imaged with sMIM using two different approaches: the first using a dual pass method with dC/dV images acquired simultaneously with sMIM during the first pass in contact mode, and the second pass at a fixed offset from the surface. The second method uses a non-resonant mode where C- V are acquired at specific lateral locations. The C- V curves are used to determine polarity compared to dC/dV and also to distinguish p-n junctions, characterize doping concentration, and build images at constant DC values to discern subtle changes not evident in traditional SCM imaging.
更多
查看译文
关键词
Scanning Microwave Impedance Microscopy,Nano-CeV,Scanning Probe Microscopy,doping characterization,Scanning Capacitance Microscopy,sMIM,SCM
AI 理解论文
溯源树
样例
生成溯源树,研究论文发展脉络
Chat Paper
正在生成论文摘要