Anisotropic conductivity enhancement in inclined W-Cu columnar films

Raya El Beainou,Roland Salut,Laurent Robert,Jean-Marc Cote,V. Potin,Nicolas Martin

Materials Letters（2018）

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摘要

•W-Cu thin films are GLAD co-sputtered.•A dense structure is obtained at the film/substrate interface.•W-Cu Janus-like architectures are produced.•Wet chemical etching of Cu favors anisotropic resistivity.

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关键词

GLancing angle deposition,Co-sputtering,W-Cu thin film,Enhanced anisotropy,Resistivity,Wet chemical etching

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