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Understanding Electromigration in Cu-CNT Composite Interconnects: A Multiscale Electrothermal Simulation Study

Jaehyun Lee,Salim Berrada,Fikru Adamu-Lema,Nicole Nagy,Vihar P. Georgiev,Toufik Sadi,Jie Liang,Raphael Ramos,Hamilton Carrillo-Nunez,Dipankar Kalita,Katharina Lilienthal,Marcus Wislicenus,Reeturaj Pandey,Bingan Chen,Kenneth B. K. Teo,Gonçalo Gonçalves,Hanako Okuno,Benjamin Uhlig,Aida Todri-Sanial,Jean Dijon,Asen Asenov

IEEE Transactions on Electron Devices（2018）

Cited 12|Views67
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Abstract
In this paper, we report a hierarchical simulation study of the electromigration (EM) problem in Cu-carbon nanotube (CNT) composite interconnects. This paper is based on the investigation of the activation energy and self-heating temperature using a multiscale electrothermal simulation framework. We first investigate the electrical and thermal properties of Cu-CNT composites, including contact res...
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Key words
Contacts,Conductivity,Discrete Fourier transforms,Resistance,Lattices,Electromigration,Thermal conductivity
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