Electroless Cobalt Via Pre-Fill Process for Advanced BEOL Metallization and Via Resistance Variation Reduction
2018 IEEE International Interconnect Technology Conference (IITC)(2018)
摘要
While processes have been developed to reduce nominal via resistance due to resistive Ta/TaN barrier layers, little effort has been made to show improvements to counteract the shrinking process window for via resistance with technology dimension. An electroless Co via-prefill process can improve nominal resistance, and in this paper, we quantitatively demonstrate improvement in process variability. Through process modeling with virtual fabrication, we also scale this prediction to 7 nm where the variability of the typical Ta/TaN approach is 50% higher with Co via-prefill.
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关键词
Cobalt via pre-fill,BEOL,via resistance
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