Advanced sensor systems by low-temperature heterogeneous 3D integration processes
2018 Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP)（2018）
Abstract
A few application demonstrators of heterogeneous 3D integrated systems including innovative nanosensors for gas detection and biofludic applications have been successfully implemented showing efficient low-temperature heterogeneous integration processes, miniaturization, low power consumption, extremely low detection limits (5 ppm) and novel functionalities very interesting for smart sensors in automotive and healthcare applications.
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Key words
Low-Temperature bonding,Through Silicon Vias (TSV),Solid-liquid interdiffusion (SLID),FET-based sensors,CNT-based gas sensor,Heterogeneous 3D Integration
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