The mechanism of pore segregation in the sintered nano Ag for high temperature power electronics applications
Materials Letters(2018)
Abstract
•The evolution of porous sintered Ag under high temperature is evaluated.•The thermal stress leads to the pore segregation under high temperature.•The pore segregation reduces thermal and mechanical properties of the bondline.
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Key words
Electronic packaging,Sintering,Porous material,High temperature reliability
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